Luoyang Hypersolid Metal Tech Co., Ltd
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1,Description:
Tungsten copper alloy plates are composite materials composed of tungsten and copper. These plates combine the high-density and high-temperature resistance of tungsten with the excellent thermal and electrical conductivity of copper, resulting in a versatile material with unique properties.
Tungsten copper alloy plates are known for their exceptional thermal and electrical conductivity. The copper matrix provides efficient heat and electricity transfer, while the tungsten particles enhance the overall strength and hardness of the material. This combination makes tungsten copper alloy plates suitable for applications requiring both high thermal and electrical conductivity, such as heat sinks, electronic packaging, and electrical contacts.
With a density ranging from 12.5 to 15.2 g/cm³, tungsten copper alloy plates exhibit high density, making them ideal for applications requiring weight or space reduction without compromising performance. They also possess excellent dimensional stability, maintaining their shape and integrity under high temperatures and mechanical stress.
2,Specifications:
| Physical Property | Description |
|---|---|
| Composition | Tungsten and Copper |
| Density | 12.5 - 15.2 g/cm³ |
| Thermal Conductivity | 180 - 230 W/(m·K) |
| Electrical Conductivity | 25 - 80% IACS (International Annealed Copper Standard) |
| Coefficient of Thermal Expansion | 4.5 - 8.8 × 10^-6 K^-1 |
| Tensile Strength | 550 - 980 MPa |
| Hardness | 140 - 320 HB |
| Melting Point | Approximately 3400 °C (6152 °F) |
| Maximum Operating Temperature | Up to 500 - 1000 °C (932 - 1832 °F) |
