Luoyang Hypersolid Metal Tech Co., Ltd
Focusing on customers, market-oriented, constantly innovating, striving for excellence.
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1,Description:
Thermal Conductivity: Tungsten copper alloy plates possess good thermal conductivity, allowing for efficient heat dissipation and thermal management in various applications.
Electrical Conductivity: Tungsten copper alloy plates have excellent electrical conductivity, making them suitable for electrical and electronic applications that require both high strength and good electrical performance.
Thermal Expansion: Tungsten copper alloy plates have a low coefficient of thermal expansion, which helps to reduce the risk of thermal stress and distortion in applications involving temperature variations.
Machinability: Tungsten copper alloy plates are relatively difficult to machine due to their high hardness. Specialized machining techniques and tools are required to shape and fabricate these plates.
Corrosion Resistance: Tungsten copper alloy plates exhibit good resistance to corrosion, making them suitable for use in environments that may involve exposure to moisture, chemicals, or other corrosive elements.
2,Specifications:
| Density | 14.0 - 16.5 g/cm³ |
| Hardness | 200 - 400 HB (Brinell Hardness) |
| Thermal Conductivity | 180 - 230 W/m·K |
| Electrical Conductivity | 25 - 90% IACS (International Annealed Copper Standard) |
| Coefficient of Thermal Expansion | 6.5 - 9.0 x 10^-6 /K |
| Corrosion Resistance | Good resistance to corrosion |
| Strength | High strength and hardness |
| Machinability | Challenging to machine due to high hardness |
| Thermal Expansion | Low coefficient of thermal expansion |
