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Tungsten Copper Alloy Bar Rod Wcu High Density Polishing Surface

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Tungsten Copper Alloy Bar Rod Wcu High Density Polishing Surface

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Brand Name :Hypersolid Metal
Model Number :tungsten copper alloy bar
Place of Origin :China
MOQ :Negotiate
Price :Negitionable
Payment Terms :D/A, L/C, D/P, T/T, Western Union, MoneyGram
Supply Ability :10000sets/month
Delivery Time :30 days after receiving down payment
Packaging Details :Standard export cartons
Density :10.2 g/cm3
Electrical Resistivity :≤0.1 μΩ·m
Melting Point :2620°C
Product Name :Molybdenum Alloys
Tensile Strength :≥400 MPa
Thermal Conductivity :≥100 W/mK
Thermal Expansion Coefficient :4.6×10-6/K
Yield Strength :≥200 MPa
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Description:

A tungsten copper alloy bar refers to a solid cylindrical bar made from a composite material consisting of tungsten and copper. This alloy combines the exceptional properties of both metals to create a high-performance material with unique characteristics.

Key features and properties of a tungsten copper alloy bar include:

  1. High-Density Construction: Tungsten copper alloys have a high density, making the alloy bar heavy and providing excellent weight-to-volume ratio. This property allows for effective energy absorption and thermal conductivity, making it suitable for applications requiring high durability and heat dissipation.

  2. Excellent Thermal Conductivity: Tungsten copper alloy bars exhibit high thermal conductivity, enabling efficient heat transfer and dissipation. This property makes them ideal for heat sinks, electrical contacts, and components requiring effective thermal management.

  3. Good Electrical Conductivity: While not as conductive as pure copper, tungsten copper alloy bars still offer good electrical conductivity. They can be used in applications where electrical conductivity is required alongside other desired properties, such as high strength or high melting point.

Specifications:

Material Composition Tungsten (W) and Copper (Cu)
Density 14.5 - 16.5 g/cm³
Melting Point Approximately 3,400 degrees Celsius (6,152 degrees Fahrenheit)
Thermal Conductivity 180 - 210 W/m·K
Coefficient of Expansion 6 - 9 x 10^(-6) K^(-1)
Electrical Conductivity 30 - 70% IACS (International Annealed Copper Standard)
Elastic Modulus 250 - 320 GPa
Hardness (Rockwell C) 25 - 30
Tensile Strength 500 - 1,200 MPa
Yield Strength 300 - 900 MPa
Elongation at Break 5 - 15%

Tungsten Copper Alloy Bar Rod Wcu High Density Polishing Surface

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