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275 MPa Molybdenum Heating Elements For Semiconductor Industry

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275 MPa Molybdenum Heating Elements For Semiconductor Industry

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Brand Name :Hypersolid Metal
Model Number :Molybdenum heating elements
Place of Origin :China
MOQ :Negotiate
Price :Negitionable
Payment Terms :D/A, L/C, D/P, T/T, Western Union, MoneyGram
Supply Ability :10000sets/month
Delivery Time :30 days after receiving down payment
Packaging Details :Standard export cartons
Boiling Point :5560°C
Density :10.2 g/cm3
Elongation :≥15%
Material :Molybdenum
Melting Point :2617°C
Tensile Strength :≥330 MPa
Thermal Conductivity :138 W/(m·K)
Yield Strength :≥275 MPa
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Description:

Molybdenum heating elements are heating components made from molybdenum, a refractory metal known for its high melting point and excellent thermal properties. Here are some descriptions of molybdenum heating elements:

  1. High melting point: Molybdenum heating elements have an exceptionally high melting point of approximately 2,620 degrees Celsius (4,748 degrees Fahrenheit). This property allows them to withstand extreme temperatures without melting or deforming, making them ideal for high-temperature heating applications.

  2. Excellent thermal conductivity: Molybdenum heating elements possess excellent thermal conductivity, allowing efficient heat transfer. They can quickly and evenly distribute heat, making them suitable for applications requiring precise and uniform heating, such as in high-temperature furnaces and industrial heating processes.

  3. Rapid heating and cooling capability: Due to their high thermal conductivity and low heat capacity, molybdenum heating elements offer rapid heating and cooling capabilities. They can heat up quickly and respond swiftly to changes in temperature, providing precise control over the heating process.

Specifications:

Chemical Symbol Mo
Atomic Number 42
Atomic Weight 95.95 g/mol
Melting Point 2,620 degrees Celsius (4,748 degrees Fahrenheit)
Boiling Point 4,612 degrees Celsius (8,354 degrees Fahrenheit)
Density 10.22 g/cm³
Crystal Structure Body-centered cubic
Electrical Conductivity 27% IACS (International Annealed Copper Standard)
Thermal Conductivity 138 W/m·K
Specific Heat Capacity 0.251 J/g·K
Coefficient of Expansion 5.1 x 10^(-6) K^(-1)
Young's Modulus 329 GPa
Tensile Strength 585-690 MPa
Elongation at Break 10-30%
Hardness (Mohs) 5.5

275 MPa Molybdenum Heating Elements For Semiconductor Industry

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